UK Trademark 2238009 Ebatronfill

Mark
Image
Mark TextEbatronfill
Status
StatusExpired
Class01
Status Before DeathRegistered
Relevant dates
Filing Date03 July 2000
Next Renewal Date03 July 2010
Registration Date15 December 2000
Expiry Date05 July 2010
Progress Stopped05 July 2010
Priority claims
Earliest Priority Date14 January 2000
CountryJapan
Publication in Trade Marks Journal
First Advert 30 August 2000
Issue number 6343, page 14633
Registration 24 January 2001
Issue number 6363
Expiry 16 July 2010
Issue number 6844
Removal 14 January 2011
Issue number 6870
List of goods or services
Class 01Plating bath for using copper plating on semi-conductors wafers.
Names and addresses
ProprietorEbara Corporation
11-1 Haneda Asahi-cho, Ota-Ku, Tokyo, Japan
Incorporated CountryJapan
Residence CountryJapan
Customers Refsjk/ar/00t056
ADP Number0444974001
ServiceForresters
15 Hamilton Square, Birkenhead, Merseyside, CH41 6BR
ADP Number0001313002